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Hong Kong Financial Secretary, Mr. John C Tsang visited San Francisco, Napa Valley and Los Angeles in California from April 29 to May 1.
The Financial Secretary gave a keynote address at the “Hong Kong – an International Financial Center” gala dinner hosted by the Hong Kong Economic and Trade Office in San Francisco (SFETO) on April 29 at the Bently Reserve. More than 200 business leaders, senior officials, consuls general and local dignitaries attended the dinner. 
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In early June, Hong Kong Secretary for Commerce and Economic Development, Mrs. Rita Lau paid her first official visit to the states of Washington and California.
In Seattle, Secretary Lau visited the Microsoft headquarters and had a meeting with its General Manager of Worldwide Industry (Government), Mr Matt Miszewski. She also had a lunch meeting with Washington Lieutenant Governor, Mr Brad Owen; the Chairman of the Board of the Federal Reserve Bank of San Francisco, Mr David Tang; the Chairman of the National US Hong Kong Business Association, Mr Benjamin Lee; the President of the Trade Development Alliance of Greater Seattle, Mr W William Stafford, and local dignitaries in Seattle.
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Hong Kong Financial Secretary John Tsang has unveiled a new round of relief measures on May 26 which will cost the Government HK$16.8 billion (US$2.15 billion), bringing the total stimulus package since last year's Budget to HK$87.6 billion (US$11.23 billion), or 5.2% of GDP.
Announcing the measures, he described them as "simple and direct" and "targeted, timely and effective", with some an enhancement of the relief measures announced in his 2009-10 Budget.
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On May 9, the Hong Kong Special Administrative Region Government and the Central People's Government agreed on further services liberalization and trade co-operation under the Mainland and Hong Kong Closer Economic Partnership Arrangement (CEPA).
Witnessed by the Chief Executive, Mr. Donald Tsang and other guests, the Financial Secretary, Mr. John C. Tsang, and the Vice-Minister of Commerce, Mr. Jiang Zengwei, signed the Supplement VI to CEPA.
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